Interface apparatus for semiconductor testing and method of manufacturing same

ABSTRACT

In one embodiment, the present invention includes an interface apparatus for semiconductor testing. The interface apparatus includes a housing. The housing includes a lower housing substrate and an upper housing substrate. The lower housing substrate has a plurality of apertures arranged according to a fine pitch, and the upper housing substrate has a plurality of apertures arranged according to a coarse pitch. A plurality of wires passes through the plurality of apertures from the lower housing substrate to the upper housing substrate. Each wire has plated conductive ends emanating from opposing sides of the housing. The plurality of apertures of the lower housing substrate corresponds to the plurality of apertures of the upper housing substrate. The interface apparatus transforms a pattern having a course pitch to a pattern having a fine pitch.

CROSS REFERENCE TO RELATED APPLICATIONS

Not applicable.

BACKGROUND

The present invention relates to an electrical/mechanical interfaceapparatus, and in particular, to interface apparatus for semiconductortesting and method of manufacturing same.

The pads on semiconductor devices are getting smaller. Traditionalcantilever probes need to scrub the pad and with smaller areas, thescrub may extend into the die area potentially causing damage to thedevice.

An alternative solution is the vertical probe. However interfacing thesevertical probe contactors to tester equipment has become more difficultas the pitch between device pads becomes less than 100 microns.

Thus, there is a need for interface apparatus for semiconductor testingand method of manufacturing same.

SUMMARY

Embodiments of the present invention include an interface apparatus forsemiconductor testing. The interface apparatus includes a first housingsubstrate, a second housing substrate, and a plurality of wires. Thefirst housing substrate has a first plurality of apertures arrangedaccording to a first pitch. The second housing substrate mates to thefirst housing substrate and has a second plurality of apertures arrangedaccording to a second pitch. The plurality of wires passes through thefirst and second plurality of apertures. Each wire has plated conductiveends emanating from opposing sides of the housing. The first pluralityof apertures corresponds to the second plurality of apertures, and thefirst pitch is less than the second pitch.

In one embodiment the interface apparatus further includes a recessedportion in at least one of the first and second housing substratesthereby providing an internal volume within the housing.

In another embodiment, the plated conductive ends are all plated withthe same material and with the same tolerance of thickness.

Embodiments of the present invention include a method of manufacturingan interface apparatus. The method includes drilling, passing,attaching, and cutting. The drilling includes drilling a first pluralityof apertures through a first housing substrate. The first plurality ofapertures is arranged according to a first pitch. The drilling includesdrilling a second plurality of apertures through a second housingsubstrate. The second plurality of apertures is arranged according to asecond pitch. The passing includes passing a plurality of wires throughthe first and second plurality of apertures. The attaching includesattaching the first housing substrate to the second housing substratethereby forming a complete housing. The cutting includes cutting wireends protruding out from the first and the second housing substrates.The first plurality of apertures corresponds to the second plurality ofapertures, and the first pitch is less than the second pitch.

In one embodiment the attaching further includes injecting epoxy into aninternal volume of the housing. The internal volume formed from arecessed portion in at least one of the first and second housingsubstrates.

In another embodiment, the method further includes plating. The platingmay occur without masking and without a fixture.

Embodiments of the present invention include a system of interfacing avertical probe assembly with an automated tester. The system includes aninterface apparatus. The interface apparatus includes a first housingsubstrate, a second housing substrate, and a plurality of wires. Thefirst housing substrate has a first plurality of apertures arrangedaccording to a first pitch. The second housing substrate mates to thefirst housing substrate and has a second plurality of apertures arrangedaccording to a second pitch. The plurality of wires passes through thefirst and second plurality of apertures. Each wire has plated conductiveends emanating from opposing sides of the housing. The first pluralityof apertures corresponds to the second plurality of apertures, and thefirst pitch is less than the second pitch. The system also includes aPCB which has a plurality of conductive pads. The plurality ofconductive pads couple with the plurality of wires positioned within thesecond plurality of apertures.

In one embodiment the system further comprises a recessed portion in atleast one of the first and second housing substrates thereby providingan internal volume within the housing.

The following detailed description and accompanying drawings provide abetter understanding of the nature and advantages of the presentinvention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an apparatus according to one embodiment of thepresent invention.

FIG. 2 illustrates a method of manufacturing an interface apparatusaccording to another embodiment of the present invention.

FIGS. 3A-D illustrate an upper housing substrate according to yetanother embodiment of the invention. FIG. 3A illustrates a contact sideof the upper housing substrate. FIG. 3B illustrates a side view of theupper housing substrate. FIG. 3C illustrates an internal view of theupper housing substrate, and FIG. 3D illustrates two 3-dimensional viewsof the upper housing substrate.

FIGS. 4A-D illustrate a lower housing substrate according to anotherembodiment of the invention. FIG. 4A illustrates a contact side of thelower housing substrate. FIG. 4B illustrates a side view of the upperhousing substrate. FIG. 4C illustrates an internal view of the lowerhousing substrate, and FIG. 3D illustrates two 3-dimensional views ofthe lower housing substrate.

FIGS. 5A-D illustrate a printed circuit board (PCB) configured to attachan interface apparatus according to yet another embodiment of theinvention. FIG. 5A illustrates a contact side of the PCB. FIG. 5Billustrates a side view of the PCB. FIG. 5C illustrates a detail of anarea of FIG. 5A and FIG. 5D illustrates two 3-dimensional views of thePCB.

FIGS. 6A-C illustrate a system of interfacing a tester with a verticalprobe contactor according to another embodiment of the invention. FIG.6A illustrates a contactor side of the system. FIG. 6B illustrates aside view of the system. FIG. 6C illustrates a 3-dimensional view of thesystem.

DETAILED DESCRIPTION

Described herein are techniques for interface apparatus and method formanufacturing same. In the following description, for purposes ofexplanation, numerous examples and specific details are set forth inorder to provide a thorough understanding of the present invention. Itwill be evident, however, to one skilled in the art that the presentinvention as defined by the claims may include some or all of thefeatures in these examples alone or in combination with other featuresdescribed below, and may further include modifications and equivalentsof the features and concepts described herein.

FIG. 1 illustrates an apparatus 100 according to one embodiment of thepresent invention. Apparatus 100 includes a housing 101 comprising anupper housing substrate 102, a lower housing substrate 103, and aplurality of wires 113 passing through plurality of apertures 109-110.Each wire has plated conductive ends emanating from opposing sideshousing 101 (e.g. 114-115). Plurality of apertures 114 corresponds toplurality of apertures 115. For every aperture of the plurality ofapertures 114, there is a corresponding aperture of plurality ofapertures 115 which the same wire of the plurality of wires 113 arethreaded through.

Plurality of apertures 109 has a pitch 111 and plurality of apertures110 has a pitch of 112. Pitch 112 is less than pitch 111. In someembodiments pitch 112 may be less than or equal to 250 microns. In someembodiments pitch 111 may be greater than or equal to 300 microns.Apparatus 100 interfaces between a course pitch provided by plurality ofapertures 109 and a fine pitch provided by plurality of apertures 110.This may allow a technology of greater than 250 micrometers capabilityto interface with another technology which has less than 100 micrometerscapability. For example, a printed circuit board (PCB) (not shown) mayhave a pattern which may be interfaced to a vertical probe contactor.

Apparatus 100 also has an internal volume 108 which is recessed on bothhousing substrate 102-103. In another embodiment, only one of thehousing substrates (i.e. housing substrate 102 or 103) may include arecessed portion to provide the internal volume. Holes 106-107 may beused to inject epoxy into the internal volume 108. In anotherembodiment, there may be a plurality of epoxy holes to aid in injectingan even flow of epoxy into internal volume 108. This plurality of epoxyholes may be arrayed along a periphery of the plurality of apertures 102or 103 in order to provide a complete adhesion of the plurality of wires113 within plurality of apertures 102-103.

Apparatus 100 also has alignment holes 104-105 and 116-117 that may beused to align housing substrate 102 to housing substrate 103 prior toattaching them with an epoxy injection as described above. Alignmentholes 104-105 and 116-117 may also be used to align apparatus 100 to aPCB. For example, plurality of apertures 109 may be arranged in a ballgrid array (BGA) pattern so that solder balls or a thick solder pastemay be distributed on a conductive BGA pattern on a PCB, and thealignment holes 104-105 and 116-117 may be used to align apparatus 100to a PCB so that heat may be applied and apparatus 100 may be solderedto the PCB. In one embodiment, the alignment holes 104-105, 116-117 maybe used to align a contactor to the apparatus 100 and a PCB (i.e.mechanically interface a contactor to a PCB) and the plurality ofapertures 109-110 may electrically interface between the contactor andthe PCB.

The plated conductive ends (e.g. 114-115) may be all plated with thesame material and with the same tolerance of thickness. This may beaccomplished if all the wire ends are plated at the same time. Forexample, a lot of similar apparatus such as apparatus 100 may be platedtogether: first by bathing the lot in nickel; and then by bathing thelot in gold. In one embodiment, housing 101 is ceramic such that onlythe wire ends will adhere to the nickel and gold (respectively).

FIG. 2 illustrates a method of manufacturing 200 an interface apparatusaccording to another embodiment of the present invention.

At 201, drill a first plurality of apertures through a first housingsubstrate. The first plurality of apertures is arranged according to afirst pitch.

At 202, drill a second plurality of apertures through a second housingsubstrate. The second plurality of apertures is arranged according to asecond pitch.

At 203, align the first and second housing substrate to each other. Thismay be accomplished by having a fixture which has steal dowels which gothrough the alignment holes on the first and second housing.

At 204, place temporary spacers between the first and second housingsubstrates. This may be used to allow enough space to thread theplurality of wires into the respective pluralities of apertures found inthe first and second housing substrates.

At, 205, pass a plurality of wires through the pluralities of aperturesaccording to a correspondence between the first and second plurality ofapertures.

At 206, attach the first and second housing substrates. This forms asingle housing. The attaching may include injecting epoxy into aninternal volume of the housing. The internal volume may be formed from arecessed portion in at least one of said first and second housingsubstrates.

At 207, cut the wire ends of the plurality of wires protruding out fromthe first and second housing substrates.

At 207, lap the wire ends.

At 208, plate the wire ends. The plating may include gold plating overan initial nickel plating. The plating may occur without masking andwithout a fixture. For example, in one embodiment, the housing may bemade of ceramic such that the entire unit may be placed into a platingbath. This would insure that all the wire ends were plated with the sametolerance of thickness and the same material. This operation does notneed masking because the plating material would not adhere to theceramic portions of the unit.

FIGS. 3A-D illustrate an upper housing substrate 300 according to yetanother embodiment of the invention. FIG. 3A illustrates a contact sideof upper housing substrate 300 showing alignment holes 314-315, epoxyinjection holes 301-313, and plurality of apertures 316. The pluralityof apertures 316 is in a BGA pattern in this embodiment.

FIG. 3B illustrates a side view of upper housing substrate 300.

FIG. 3C illustrates an internal view of upper housing substrate 300showing alignment holes 314-315 and plurality of apertures 316.

FIG. 3D illustrates two 3-dimensional views of upper housing substrate300. Upper housing substrate 300 includes a recessed portion 317 inwhich a plurality of wires and an epoxy may reside.

FIGS. 4A-D illustrate a lower housing substrate 400 according to anotherembodiment of the invention. FIG. 4A illustrates a contact side of lowerhousing substrate 400 showing plurality of apertures 401-402 andalignment holes 403-404.

FIG. 4B illustrates a side view of upper housing substrate 400.

FIG. 4C illustrates an internal view of lower housing substrate 400showing plurality of apertures 401-402 and alignment holes 403-404.

FIG. 4D illustrates two 3-dimensional views of lower housing substrate400. Lower housing substrate 400 includes plurality of apertures 401-402and a recessed portion 405 in which a plurality of wires and an epoxymay reside.

FIGS. 5A-D illustrate a printed circuit board 500 (PCB) configured toattach an interface apparatus according to yet another embodiment of theinvention. FIG. 5A illustrates a contact side of PCB 500 showingalignment holes 502-503 and a plurality of conductive pads 501. Area 504shows the contact area where an interface apparatus may be attached.

FIG. 5B illustrates a side view of PCB 500. PCB 500 includes a pluralityof pins to interface to a test plate. PCB 500 may be a daughter boardconfigured as a contactor interface board. In one embodiment, PCB 500may be a general interface board which may be used on a family of testplates in order to quickly replace the vertical probes on a test system.

FIG. 5C illustrates a detail of area 504 of FIG. 5A showing alignmentholes 502-503 and conductive pads 501. In one embodiment, conductivepads 501 may have a solder mask. In another embodiment, the plurality ofconductive pads 501 may be arranged in a BGA pattern and bumped withsolder balls (e.g. solder ball 505). The plurality of conductive pads501 may have positions to couple with a plurality of wires positionedwithin a plurality of apertures also arranged in the same BGA pattern.

FIG. 5D illustrates two 3-dimensional views of PCB 500. Contactor side506 may be where an interface apparatus may be attached. PCB 500 may beattached to a tester though a test plate from the tester side 507 side.

FIGS. 6A-C illustrate a system 600 of interfacing a tester with avertical probe contactor according to another embodiment of theinvention. FIG. 6A illustrates a contactor side of system 600 showinginterface apparatus 604 attached to PCB 601. Interface apparatus 604includes a plurality of conductive ends 608-609 and alignment holes606-607. System 600 is a dual site interface system designed to contact2 die simultaneously. Other configurations of multisite arrangements arealso possible in other embodiments. Alignment holes 606-607 may be usedto align a contactor to interface apparatus 604.

FIG. 6B illustrates a side view of system 600. FIG. 6B shows PCB 601having a plurality of pins 605 on the tester side of system 600 and aninterface apparatus 604 attached on the contactor side of system 600.Interface apparatus 604 includes an upper housing substrate 602 and alower housing substrate 603.

FIG. 6C illustrates a 3-dimensional view of system 600. FIG. 6C showsthe contactor side 610 of system 600. Interface apparatus 604 is shownattached to PCB 601. In other embodiments, interface apparatus 604 maybe attached directly to a test plate which interfaces to a tester. Inanother embodiment, interface apparatus 604 may be attached to a swapblock which couples to test instruments through a pogo tower and generalinterface PCB.

The above description illustrates various embodiments of the presentinvention along with examples of how aspects of the present inventionmay be implemented. The above examples and embodiments should not bedeemed to be the only embodiments, and are presented to illustrate theflexibility and advantages of the present invention. Based on the abovedisclosure, other arrangements, embodiments, implementations andequivalents will be evident to those skilled in the art and may beemployed without departing from the spirit and scope of the invention.

What is claimed is:
 1. A method of manufacturing an interface apparatus,said method comprising: drilling a first plurality of apertures througha first housing substrate, said first plurality of apertures arrangedaccording to a first pitch; forming a recessed portion in a secondhousing substrate; drilling a second plurality of apertures through saidsecond housing substrate, said second plurality of apertures arrangedaccording to a second pitch; drilling a plurality of injection holes(being disposed) between boundaries of said recessed portion and aperiphery of said second plurality of apertures; passing a plurality ofwires through said first and second plurality of apertures; attachingsaid first housing substrate to said second housing substrate therebyforming a housing; and cutting a wire ends protruding out from saidfirst and said second housing substrates, wherein said first pluralityof apertures corresponds to said second plurality of apertures, andwherein said first pitch is less than said second pitch.
 2. The methodof claim 1 wherein said attaching further includes injecting epoxy intosaid recessed portion through said plurality of injection holes.
 3. Themethod of claim 1 further comprising placing temporary spacers betweensaid first and second housing substrates.
 4. The method of claim 3further comprising aligning said first and said second housingsubstrate.
 5. The method of claim 1 further comprising: lapping saidwire ends; and plating said wire ends.
 6. The method of claim 5 whereinsaid plating occurs without masking and without a fixture.
 7. The methodof claim 5 further comprising: bumping a plurality of conductive pads ofa printed circuit board (PCB), said plurality of conductive pads havinga position to couple with said plurality of wires positioned within saidsecond plurality of apertures; and soldering said housing to said PCB byheating a solder of said bumping.